| Event | MoU & NDA Signing Ceremony |
| Industry Partner | BONbLOC Technologies |
| Date | 27.07.2026 |
| Venue | Easwari Engineering College, Chennai |
| Organized by | Department of CSE (Cyber Security) & Department of Computer Science and Business Systems |
Signing of the Memorandum of Understanding (MoU) & NDA
The Department of Computer Science and Engineering (Cyber Security) and the Department of Computer Science and Business Systems of Easwari Engineering College successfully organized the Memorandum of Understanding (MoU) and Non-Disclosure Agreement (NDA) Signing Ceremony with BONbLOC Technologies on 27 July 2026. The collaboration marks an important milestone in strengthening industry–academia partnerships aimed at enhancing student learning, innovation, research, and industry readiness.
BONbLOC Technologies, an organization specializing in Artificial Intelligence (AI), Internet of Things (IoT), Blockchain solutions, and Digital Transformation, partnered with the institution to promote collaborative initiatives in emerging technologies. The MoU was signed in the presence of Dr. R. Shivakumar, Chairman, Easwari Engineering College, along with Ms. Sujatha Yegnaraman, Vice President – Operations, BONbLOC Technologies, Ms. Jamunadevi Dhayanidhi, Vice President – Global Branding, Marketing and Business Development, BONbLOC Technologies, faculty members, and department representatives.
Key Areas of Collaboration
Establish a long-term academia–industry partnership in Artificial Intelligence, Data Science, IoT, Blockchain, Cloud Computing, and Digital Transformation.
Bridge the gap between academic learning and industry requirements.
Promote innovation, research, and technology commercialization.
Enhance students’ employability through industry exposure and skill development.
Support faculty development through collaborative research and technical training.
Encourage entrepreneurship and startup incubation initiatives.
Outcomes of the MoU
Industry-led workshops, seminars, guest lectures, and certification programs.
Internship and industrial training opportunities for students.
Joint research projects, publications, and patent filings.
Development of real-world industry projects and student capstone projects.
Collaborative AI and digital transformation solutions addressing industry challenges.
Improved placement opportunities through industry engagement.
Conclusion
The MoU and NDA signing ceremony with BONbLOC Technologies marks the beginning of a valuable industry partnership for Easwari Engineering College. The collaboration is expected to create significant opportunities in research, innovation, internships, training, and emerging technology domains while preparing students with the skills required for the rapidly evolving digital industry.
